MCP6792 |Processor AMC (PrAMC) Module
Description
The MCP6792 is a Processor AMC (PrAMC) module designed for insertion directly into a MicroTCA© (uTCA©) backplanes or the AMC slots of an AdvancedTCA© (ATCA©) blade or carrier card. The AMC's Small Form Factor (SFF), dual-core processor options deliver impressive performance. The embedded and power-efficient Intel® Core© 2 Duo Processor SL9400 and the Intel® GS45 Express Chipset are used to enable 4GB of DDR3 memory, multiple PCI Express® links, three Gigabit Ethernet interfaces and much more.
Model number and model name definitions:
6792 MCP = Dual Core processor, standard-memory configuration
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PROCESSOR & PACKAGE STYLE
Intel® Core® 2 Duo Processor SP9300 (2.26GHz)
Intel® Core® 2 Duo Processor SL9400 (1.86GHz)
Intel® Core® 2 Duo Processor SU9300 (1.2GHz)
Processor Package = SFF (22mm x 22mm), BGA
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CACHE MEMORY (L2)
Intel® Core® 2 Duo Processor SP9300 & SL9400 - 6MB
Intel® Core® 2 Duo Processor SU9300 - 3MB
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CHIPSET
The Intel® GS45 Express Chipset with the Intel® ICH9M I/O Controller Hub (SFF versions)
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SYSTEM BUS & MEMORY
System Bus = 1066/800MHz
Memory Interface Structure = Dual-channel interface with two DDR3 SO-DIMM sockets
Class = DDR3-1066
Max. = 4GB (8GB maximum memory capability is currently under evaluation.)
Min. = 512MB
SO-DIMM Type = PC3-8500, PC3-6400, 64-bit non-ECC, unbuffered
SO-DIMM Construction = Gold card-edge fingers
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EDGE CARD INTERFACES
PCI Express Links = one x4 or four x1 and one x1 plus reference clocks
PCIe Link Configuration = A six-position dip switch enables multiple PCIe link configurations
Ethernet = 2, 1000Base-BX Ethernet interfaces
SATA = 2, SATA II 300 interfaces
IPMB = 1, Intelligent Platfrom Management Bus for use by the card¡¯s MMC interfaces in IPMI implementations
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VIDEO INTERFACE
Video Controller: Internal to the GS45 GMCH via Intel® Graphics Media Accelerator 4500MHD.
The GMA 4500MHD and the Trenton MCP6792 features BIOS selectable shared video memory capacities of 0MB, 32MB, 64MB or 128MB.
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BATTERY
Type: Lithium
Purpose: CMOS data retention
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I/O INTERFACES
USB: 2, USB 2.0 interfaces - 2 front panel ports (full-size) or 1 front panel port (mid-size)
Local Storage: 1, Dedicated USB header supports plug-in USB SSD NAND storage devices with storage densities up to 8GB
COM: 1, Serial port (full-size front panel only)
LEDs: 4, POST code and activity LEDs (full-size front panel only) and 3 Operating status LEDs (all card versions)
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BIOS (FLASH)
The AMC's BIOS is AMIBIOS8®. The card¡¯s BIOS resides in the two SPI flash modules. Some of the key features of the BIOS are:
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Boot from network, USB mass storage devices or SATA drives
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Support for flash devices for BIOS upgrading
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Integrated suppport for USB mass storage devices such as USB flash drives, DVD-RW, CD-ROM, CD-RW, etc.
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SATA support includes 48-bit LBA addressing to support SATA hard drive capacities over 137GB
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ETHERNET INTERFACES
Front Panel = 1, 10/100/1000Base-T via an Intel® 825567 Ethernet PHY connected to the card's ICH
Edge Card Connector = 2, 1000Base-BX via an Intel® 82571EB Dual Port Ethernet Controller driven by a x4 PCI Express link from the board's GMCH
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STANDARDS
- PCI Express Base Specification 1.0a
- PICMG® AMC.0, R2.0 Specification
- PICMG® AMC.1, R2.0 Specification (PCI Express Implementation)
- PICMG® AMC.2 Specification (Ethernet Implementation)
- PICMG® AMC.3 Specification (Storage Implementation)
- PICMG® MTCA.0, R1.0 Specification (MicroTCA)
- PICMG® 3.0, R 3.0 Specification (AdvancedTCA)
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WATCHDOG TIMER
Not Applicable
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MECHANICAL
A standard low-profile, passive heatsink complies with the various industry specifications for AMC card height.
MCP6792 Dimensions = 7.11" (18.05cm) L x 2.89"(7.34cm) H
Single-width/Full-size Front Panel Height = 1.103" (28.00mm)
Single-width/Mid-size Front Panel Height = 0.709" (18.00mm)
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AGENCY APPROVALS & COMPLIANCE
Designed for UL60950, CAN/CSA C22.2 No. 60950-00, EN55022:1998Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994 and NEBS/ETSI compliance
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MEAN TIME BETWEEN FAILURES (MTBF)
MTBF = TBD Power-On Hours (POH) at 40 oC per Bellcore
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POWER REQUIREMENTS - 100% stressed
Typical Values - 100% CPU Stress State
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CPU |
+12V |
+3.3V* |
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2.26GHz |
2.70A |
0.15A |
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1.86GHz |
2.08A |
0.15A |
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1.2GHz |
1.98A |
0.15A |
Tolerance for all voltages is +/-5%
All processors are dual-core CPUs
4GB of system memory was installed during power testing
*Management Power current draw is typically 150mA or less |
POWER REQUIREMENTS - Idle
Typical Values - CPU Idle State
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CPU |
+12V |
+3.3V* |
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2.26GHz |
1.17A |
0.15A |
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1.86GHz |
1.09A |
0.15A |
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1.2GHz |
1.16A |
0.15A |
Tolerance for all voltages is +/-5%
All processors are dual-core CPUs
4GB of system memory was installed during power testing
*Management Power current draw is typically 150mA or less |
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TEMPERATURE & ENVIRONMENTALS
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Operating Temperature: |
-5 oC to 55 oC. |
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Storage Temperature: |
-20 oC to 70 oC. |
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OTHER ENVIRONMENTAL REQUIREMENTS
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Airflow Requirement: |
300LFM continuous airflow |
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Humidity: |
5% to 90% non-condensing |
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MEMORY SLOT POPULATION
A memory module can be installed in only one SO-DIMM socket. If only one SO-DIMM module is used, it must be populated in SO-DIMM socket 1A. The AMC™'s memory interface operates at maximum bandwidth with two SO-DIMMs of the same size installed in sockets 1A and 1B and the SO-DIMMs may differ in technology (i.e. component density) and/or device width.
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IOBxx EXPANSION BOARDS (OPTIONAL)
Not Applicable
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